Siemens & nVent: Inside the 100MW AI Data Centre Blueprint

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Ciaran Flanagan, Global Head of Data Center Solutions at Siemens
The blueprint from Siemens and nVent is engineered to accelerate the deployment of large-scale, liquid-cooled data centres for Nvidia AI infrastructure

Siemens and nVent have revealed a joint reference architecture to help operators speed up the construction of hyperscale AI data centres.

Siemens and nVent have merged their expertise in electrical systems and liquid cooling to produce a Tier III-capable blueprint.

It is specifically designed for high-density Nvidia AI infrastructure, such as the Nvidia DGX SuperPOD with DGX GB200 systems.

The collaboration brings together Siemens' industrial power distribution and nVent's advanced cooling solutions.

Sara Zawoyski, President of nVent Systems Protection, says the partnership aligns with nVent's established focus on advanced cooling.

ā€œWe have decades of expertise supporting customers’ next-generation computing infrastructure needs,ā€ she says.

ā€œThis collaboration with Siemens reinforces that commitment. The joint reference architecture will help Data Centre Managers deploy our cutting-edge cooling infrastructure to support the AI buildout.ā€

Sara Zawoyski, President of nVent Systems Protection (Credit: nVent)

Blueprint for 100MW AI campuses

The reference design is intended for data centres scaling to approximately 100MW. It features liquid-cooled racks and dense compute clusters structured around Nvidia’s AI designs.

By aligning the blueprint with Nvidia DGX SuperPOD reference models, Siemens and nVent seek to lower integration complexity and assist operators in deploying large-scale AI environments more rapidly.

This design pairs Siemens’ industrial-grade power distribution automation and energy management systems with nVent’s liquid cooling portfolio.

According to Siemens and nVent, this combination provides a cohesive technical framework for high-density workloads.

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It could address the increasing power consumption, cooling demands and operational risks found across hyperscale facilities.

The architecture is designed to offer a standardised route for deployment, potentially reducing fragmented engineering processes and shortening project timelines.

Maximising AI output and efficiency

The growing adoption of AI is continuing to push rack densities higher, which in turn increases the operational importance of cooling efficiency and electrical resilience. For operators building AI-specific compute environments, key challenges now include power availability, heat rejection and modular expansion.

The reference architecture aims to provide a clear path forward.

Siemens and nVent are collaborating to develop a liquid cooling and power reference architecture, purpose-built for hyperscale AI workloads (Credit: Siemens)

Ciaran Flanagan, Global Head of Data Center Solutions at Siemens, explains how the architecture is meant to support both scale and energy efficiency.

ā€œThis reference architecture accelerates time-to-compute and maximises tokens-per-watt, which is the measure of AI output per unit of energy,ā€ he says.

ā€œIt’s a blueprint for scale: modular, fault-tolerant and energy-efficient. Together with nVent and our broader ecosystem of partners, we’re connecting the dots across the value chain to foster innovation, interoperability and sustainability, helping operators build future-ready data centres that unlock AI’s full potential.ā€

Siemens' solutions are helping to decarbonise the data centre industry (Credit: Siemens)

Integrated power and cooling foundation

Siemens contributes a wide range of technologies to the collaboration. These include medium and low voltage power distribution, scalable automation, energy management software and digital services.

Its portfolio features IoT-enabled hardware, AI-driven applications and cloud-connected tools created to support operational transparency and improve energy performance.

For AI data centres, Siemens’ electrical systems provide the basis for stable high-density deployments.

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nVent provides liquid cooling technologies engineered for high-density compute environments, developed through partnerships with chip manufacturers, OEMs and hyperscalers.

Its solutions are designed to manage thermal loads at scale, maintain efficiency and support future compute generations without requiring major infrastructure overhauls.

The new blueprint incorporates learnings from nVent's experience in delivering cooling environments for global cloud providers and large operators into a model ready for deployment.

The joint architecture from Siemens and nVent is set to support operators in building the next wave of AI-ready data centres, where performance, sustainability and deployment speed are closely linked to electrical design and advanced cooling.

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