Schneider Electric's Bold Bid to Tackle AI Power Demands

With more and more data centres heating up the global race to monetise AI, Schneider Electric is cooling down the computational chaos by helping organisations deploy AI-ready infrastructure responsibly. 

At Datacloud Global Congress 2026, the energy giant will demonstrate how to manage this explosive growth through next-generation power architectures, heavy-duty liquid cooling technologies, intelligent software and digital services. 

The event is set to take place from 1-4 June, where the technology industry will gather in Cannes, France, to understand and navigate this monumental engineering shift. 

According to Morgan Stanley Research, nearly US$3tn of AI-related infrastructure investment is expected to flood the global economy by 2028, while Gartner forecasts worldwide AI spending will exceed US$2.5tn in 2026 alone.

Operators can no longer rely on legacy electrical engineering to support next-gen silicon. The sheer computational weight of modern Gen AI is pushing traditional facilities to their physical limits. 

This creates brutal bottlenecks around grid power availability, rocketing rack densities, thermal management and overall network resiliency.

NVIDIA blueprints to guide infrastructure simulation

Designing and operating a facility that draws massive amounts of power requires advanced digital engineering before physical construction begins. 

On the first day of the event, Sébastien Cruz-Mermy, VP Datacenter Innovation at Schneider Electric, will lead a technical session charting the operational blueprint of these AI factories.

Sébastien will explore how ultra-high-density rack design, next-gen DC power delivery architectures and aggressive cooling strategies are shifting from luxury options to baseline operational necessities.

Later, Schneider Electric and NVIDIA will co-host an exclusive, invitation-only executive briefing for senior technology leaders. The private session will bring together industry pioneers to dissect the fast-changing landscape of AI-driven computing.

The briefing will explore the 5-Layer Cake framework of NVIDIA. This includes the highly anticipated DSX Blueprint, supported by immersive Digital Twins, which bridges the gap between early-stage data centre design, deployment and daily operations.

A radical ecosystem collaboration

The data centre ecosystem must evolve immediately if it hopes to survive the massive weight of modern digital workloads. 

On 2 June, Frédéric Godemel, EVP Energy Management Business at Schneider Electric, will join executives from Oracle, DATA4, QTS Data Centres and CBRE for a critical keynote panel dissecting the issue.

Focused on ‘How is the Data Center Ecosystem Keeping up with AI Demand’, the panel will discuss why neoclouds are disrupting the market, how their deployments differ from hyperscale or enterprise requirements and how Europe can keep pace. 

On the same day, Schneider will also host a tactical panel session exploring how operators can de-risk their heavy energy investments before breaking ground. 

Thierry Chamayou, Vice President of Cloud and Service Providers in EMEA at Schneider Electric, will join industry specialists from GreenScale, Trench Group, Kao Data, JSM Group and Solar Turbines to map out the infrastructure growth strategies.

The session will focus on innovative project funding structures, tighter utility collaboration and proactive engagement with local governments. 

Deep industry collaboration is no longer optional as it is the only way to build scalable, resilient and sustainable infrastructure capable of surviving the AI era.

Marc Garner, Global President Cloud and Service Provider Segment at Schneider Electric, says: “AI is fundamentally reshaping the future of digital infrastructure, creating new demands around power, cooling and resiliency, at unprecedented scale. 

“At Datacloud Global Congress, we will demonstrate how collaboration across the ecosystem is enabling the next generation of AI factories and helping organisations build scalable, resilient and sustainable infrastructure, built for the AI era.”

Liquid cooling solutions 

The event will tackle the industry's ultimate battleground of physical cooling by featuring the exact hardware and software innovations engineered to stop high-density chips from melting. 

This includes the newly introduced 800 VDC architecture alongside engineering tools that help operators design, simulate, build and maintain AI-ready sites.

Schneider Electric’s latest digital simulation capabilities will be demonstrated as they become increasingly important for large-scale AI deployments. 

This would include deep NVIDIA Omniverse integrations, Digital Twin technologies, NVIDIA Reference Designs for its GB300 NVL72 platform and Grace Blackwell Ultra architecture, alongside Smart Spatial experiences.

Visitors will also get a firsthand look at the latest liquid cooling technologies from Motivair by Schneider Electric. 

The physical display features the new MCDU-70, a massive 2.5MW Coolant Distribution Unit (CDU) engineered specifically to cool data centres operating at gigawatt scale.

In addition, Schneider Electric will demonstrate its end-to-end AI command centre capabilities. These central operations tools include EcoStruxure IT DCIM and EcoStruxure Foresight software, alongside Microgrid and Data Center Services.